Stencil Coating Wipe renders stencil surface fluxophobic.

Forming chemical bond with stencil surface, DEK Nano-ProTek minimizes ability of flux to stick to aperture and bottom side of stencil, enabling stainless steel or nickel stencils to be easily cleaned for optimal results. Wipe optimizes both capacity of understencil cleaner and gasketing of stencil to PCB. It can be applied to new and existing stencils at room temperature and may be re-applied as required.

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Stencil Coating Wipe renders stencil surface fluxophobic.