Wafer Plating Tool suits R/D and low-volume applications.

Featuring single plating cell and dragout rinse cell, SEMCON 1000 provides uniform plating of most patterned wafers, MEMS-based substrates, and similar applications. Plating cell components include heating temperature control, low level safety device, pump and filter, DC power supply, and wafer holder. Self-contained solution is constructed of white polypropylene with clear PVC process cover designed to meet class 1000 clean room specification.

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Wafer Plating Tool suits R/D and low-volume applications.